YAG/YLF Series Laser
Characteristics:Long Time Application in Market and High Popularity
Characteristics:Operated on Machine or Computer
Characteristics:Small Dimension of Laser Head, Easy for the Integration of External Optical Circuit Design, Compact Structure and Low Power Dissipation

Diode Pumped Solid State UV Laser

Technical Parameters
MODEL Pulse-355-3Y Pulse-355-5Y
Wavelength(nm) 355
Pulse Repetition Rate Range 1kHz to 150kHz(Options:single shot to 200kHz)
Pulse Width (ns) @30kHZ ≤16
Average Power >3W@10KHZ >5W@10KHZ
Average Power Stability  <±3% over 24 hours
Pulse-to-Pulse instability <3%rms
Spatial Mode TEM00(M2 <1.3)
Beam Divergence Full Angle  < 2 mrad
1/e2 Beam Diameter  0.7mm
Beam Roundness >90%
Pointing stability <50urad
Polarization Direction Horizontal
Polarization Ratio 100:1
Cooling Water/Air-cooling Water-cooling

Application
ITO Film Etching,Ceramic Cutting, Scribing and Marking, Glass Cutting and Marking, Polymeric Material Marking and Cutting, Material Microprocessing, Wafer Cutting,Laser Rapid Prototyping, Scientific Research.

Diode Pumped Solid State Green Laser

Technical Parameters
MODEL Pulse-532-05-Y Super Pulse-532-12-Y
Wavelength(nm) 532
Pulse Repetition Rate Range  1kHz to 150kHz
Pulse Width (ns) @30kHZ <35ns
Average Power@30kHz >5W@10kHz;
>2W@2kHz 
>12W@10kHz;
Average Power Stability  <±3% over 12 hours
Pulse-to-Pulse instability <3%rms
Spatial Mode TEM00(M2 <1.2) TEM00(M2 <1.3)
Beam Divergence Full Angle  < 2 mrad
1/e2 Beam Diameter  0.7 mm
Beam Roundness >90%
Pointing stability <50urad
Polarization Direction Horizontal
Polarization Ratio 100:1
Operating Voltage 90-260VAC
Cooling Air-cooling/Water-cooling Water-cooling

Application
Film Solar Energy Etching, Silicon Slicing,Glass and Ceramic Marking,Laser Trimming Resistence, Cutting and Scribing, Micropore Drilling, PCB Drilling, Diamond Cutting.

Diode Pumped Solid State IR Laser

Technical Parameters
MODEL Pulse 1064-5-Y Pulse 1064-10-Y Super Pulse 1064-15-Y
Wavelength(nm) 1064
Pulse Repetition Rate Range  1kHz to 150kHz(Options:single shot to 200kHz)
Pulse Width (ns) @30kHZ <18
Average Power >5W@30kHz >10W@CW;
>8W@30kHz
>15W@CW;
>12W@30kHz
Average Power Stability  <±3% over 24 hours
Pulse-to-Pulse instability <3%rms
Spatial Mode TEM00(M2 <1.2) TEM00(M2 <1.5)
Beam Divergence Full Angle  < 2 mrad
1/e2 Beam Diameter  0.7mm
Beam Roundness >90%
Pointing stability <50urad
Operating Voltage 90-260VAC
Cooling Air-cooling Water-cooling

Application
P1 Layer Etching of Thin Film Solar Energy, ITO Film Etching, Laser Trimming Resistance, Marking, Cutting and Scribing, Scientic Research, Diamond Cutting.

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